A New Approach for the Study of Chemical Mechanical Polishing
- 1 January 1999
- journal article
- Published by The Electrochemical Society in Electrochemical and Solid-State Letters
- Vol. 3 (2)
- https://doi.org/10.1149/1.1390967
Abstract
The process of chemical mechanical polishing (CMP) can be studied using in situ atomic force microscopy (AFM) by intentionally using a high tip/sample interaction force. The nominal removal rate of Al during AFM scratching is studied under a range of conditions including varying tip/sample force, solution pH, and electrode potential. This approach should be useful for CMP process development and furthering the fundamental understanding of CMP mechanisms.Keywords
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