Monitoring the moduli of polymers with ultrasound
- 1 March 1974
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 45 (3) , 1218-1222
- https://doi.org/10.1063/1.1663392
Abstract
Two ultrasonic methods are presented for the measurement and monitoring of the elastic moduli of polymers and other liquids undergoing solidification. The methods are thought to be most sensitive to the buildup of the real component of the modulus of rigidity of the material. Ultrasonic traveling waves are used to interrogate a boundary between the solid body transmitting the wave and the sample under test. Data on epoxy resins are given. During the hardening process, the measured modulus includes contributions from viscoelastic and glass transition effects which are not separated from the total modulus by the measurement methods.This publication has 3 references indexed in Scilit:
- Traveling Wave Reflection Methods for Measuring Ultrasonic Attenuation and Velocity in Thin Rods and WiresJournal of Applied Physics, 1971
- Relation between the network structure and dynamic mechanical properties of a typical amine‐cured epoxy polymerJournal of Polymer Science Part A-2: Polymer Physics, 1970
- Joule and Wiedemann Effects-The Simultaneous Generation of Longitudinal and Torsional Stress Pulses in Magnetostrictive MaterialsIEEE Transactions on Sonics and Ultrasonics, 1966