Analysis of Solders by X-Ray Spectrometry
- 1 March 1968
- journal article
- research article
- Published by SAGE Publications in Applied Spectroscopy
- Vol. 22 (2) , 105-108
- https://doi.org/10.1366/000370268774383624
Abstract
The determination of several percent of Au, Ag, and Cu in various Sn/Pb solder compositions used in the manufacture of microelectronic circuits is described. Details of the preparation of standards and x-ray procedure are given. The Au calibration curve can be prepared from any Sn/Pb composition. The Ag and Cu calibration curves must be prepared for each solder composition.Keywords
This publication has 1 reference indexed in Scilit:
- X-Ray Absorption and EmissionAnalytical Chemistry, 1960