Residual stresses in electrodeposited nickel monocrystals
- 31 January 1976
- journal article
- Published by Elsevier in Surface Technology
- Vol. 4 (1) , 41-58
- https://doi.org/10.1016/0376-4583(76)90016-9
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Relaxation of Internal Stresses in Electrodeposits during Stress Measurement by Null-Deflection MethodsJournal of the Electrochemical Society, 1971
- Physical and Mechanical Properties of Electrodeposited CopperJournal of the Electrochemical Society, 1970
- Physical and Mechanical Properties of Electrodeposited CopperJournal of the Electrochemical Society, 1970
- Physical and Mechanical Properties of Electrodeposited CopperJournal of the Electrochemical Society, 1970
- The structure of electrodeposited copper—IElectrochimica Acta, 1960
- An Instrument for the Continuous Measurement of Stress in ElectrodepositsTransactions of the IMF, 1956