Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits

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Abstract
Analytical and numerical techniques formulated to model uniform and nonuniform lines are used to compute signal delays distortion and crosstalk in interconnects and packaging. The techniques presented include the use of CAD compatible circuit models and computational techniques based on time and frequency domain solution of multiconductor lossy interconnects. Typical numerical results for the pulse propagation characteristics of uniformly and nonuniformly coupled interconnects are presented.

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