Thermal characteristics of a four-chip magnetic bubble package
- 1 September 1977
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Magnetics
- Vol. 13 (5) , 1373-1375
- https://doi.org/10.1109/tmag.1977.1059580
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Magnetic bubbles—An emerging new memory technologyProceedings of the IEEE, 1975