A Three-dimensional Optical Interconnection Network For Fine-grain Parallel Architectures

Publisher Website

1 January 1993

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. H21-H22
https://doi.org/10.1109/leosst.1993.696872

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Vertical optical communication through stacked silicon wafers using hybrid monolithic thin film InGaAsP emitters and detectors
IEEE Photonics Technology Letters, 1993
Alignable epitaxial liftoff of GaAs materials with selective deposition using polyimide diaphragms
IEEE Photonics Technology Letters, 1991