Fatigue Failure of Encapsulated Gold-Beam Lead and TAB Devices
- 1 June 1978
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 1 (2) , 158-166
- https://doi.org/10.1109/tchmt.1978.1135265
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- The Mechanics of Gold Beam Leads During Thermocompression BondingIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV DispersionIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Thermal Stress and Low Cycle FatigueJournal of Applied Mechanics, 1966
- Large-deformation analyses of bonded elastic mountsZeitschrift für angewandte Mathematik und Physik, 1966
- The Compression of Bonded Rubber BlocksProceedings of the Institution of Mechanical Engineers, 1959
- On Prager's hardening ruleZeitschrift für angewandte Mathematik und Physik, 1958
- The Theory of Plasticity: A Survey of Recent AchievementsProceedings of the Institution of Mechanical Engineers, 1955