Recent progress in Pb-free solders and soldering technologies
- 1 June 2001
- journal article
- Published by Springer Nature in JOM
- Vol. 53 (6) , 16
- https://doi.org/10.1007/s11837-001-0096-6
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Development of lead (Pb)-free interconnection materials for microelectronicsMetals and Materials, 1999
- Development and validation of a lead-free alloy for solder paste applicationsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1997
- Lead (Pb)-free solders for electronic packagingJournal of Electronic Materials, 1994