Stability of TiN Films Prepared by Chemical Vapor Deposition Using Tetrakis‐dimethylamino Titanium
- 1 September 1996
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 143 (9) , L188-L190
- https://doi.org/10.1149/1.1837081
Abstract
The effect of in situ plasma post‐treatment on the stability of TDMAT‐based CVD TiN films was studied. Post‐treatment greatly improves the film stability in air regardless of conditions of the plasma treatment. Among the tested variables, the plasma exposure time strongly affects the resistivity and carbon content of the deposits. Longer treatment results in reduced carbon content and enhanced stability in air. With increasing treatment time, the resistivity decreased exponentially and then finally saturated at a certain value. At a fixed time for plasma treatment, increasing the ratio provides better film stability compared to increasing RF power. However, no noticeable difference of carbon content in the film was observed with variation of RF power and the ratio of at a fixed treatment time. An enhancement of film crystallinity was observed as plasma post‐treatment.Keywords
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