Bond integrity evaluation using transmission scanning acoustic microscopy
- 6 November 1980
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 16 (23) , 880-882
- https://doi.org/10.1049/el:19800628
Abstract
Low frequency transmission scanning acoustic microscopy is capable of revealing voids and delaminations at substantial depths inside a solid material. The technique is demonstrated with reference to the bond between a carbon diamond compound sintered to a steel base. A resolution comparable to the wavelength inside the solid material is achieved.Keywords
This publication has 1 reference indexed in Scilit:
- The Acoustic Microscope: A Tool for Nondestructive TestingPublished by Springer Nature ,1979