Viscoelastic Behavior of Polymer Thin‐Films Under Thermal Stresses

Publisher Website

1 January 1996

journal article
Published by Springer Nature in MRS Proceedings

Vol. 445
https://doi.org/10.1557/proc-445-185

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Characterization of polyimides used in high density interconnects
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
Introduction to Polymer Viscoelasticity
Physics Today, 1973