The solid phase bonding of copper, nickel and some of their alloys to diamonds
- 1 June 1976
- journal article
- Published by Springer Nature in Journal of Materials Science
- Vol. 11 (6) , 1083-1090
- https://doi.org/10.1007/bf02396642
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- The wetting and bonding of diamonds by copper-base binary alloysJournal of Materials Science, 1975
- The adhesion of metal/alumina interfacesJournal of Materials Science, 1968