Fully Embedded Board-Level Optical Interconnects From Waveguide Fabrication to Device Integration
- 12 February 2008
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Lightwave Technology
- Vol. 26 (2) , 243-250
- https://doi.org/10.1109/jlt.2007.911115
Abstract
This paper presents the latest progress toward fully embedded board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45deg micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide propagation loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting mirror, which is embedded in the thin-film waveguide, is simulated by an M2 factor revised Gaussian beam method and is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.Keywords
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