The Stacking‐Fault Energies of Ag(Mn) and Cu(Mn) Solid Solutions

Abstract
The stacking‐fault energies of the Ag(Mn) and Cu(Mn) solid solutions have been determined for various compositions up to 18 at.% solute by the method involving measurement of extended node radii. The computed energies correlate very closely with earlier x‐ray measurements of stacking‐fault probabilities, confirming that manganese has a different effect on the fault energy of the two solid solutions. The stacking‐fault energy of silver is changed very little by manganese, possibly because of two offsetting contributions to the energy: (1) a tendency for γ to decrease due to an increase in valency‐electron/atom ratio, and (2) a tendency for γ to increase because of d‐shell interactions due to holes in the stable half‐filled Mn 3d shell. The stacking‐fault energy of copper is reduced by magnanese, probably because the Mn atoms are compressed so that the 3d shell behaves as if it were completely filled. Thus, manganese behaves as a multivalent element in reducing γ of copper.

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