Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications

Publisher Website

1 January 1996

journal article
Published by Springer Nature in MRS Proceedings

Vol. 443
https://doi.org/10.1557/proc-443-171

Abstract

No abstract available

Keywords

This publication has 1 reference indexed in Scilit:

Copper-Based Metallization in ULSI Structures: Part II: Is Cu Ahead of Its Time as an On-Chip Interconnect Material?
MRS Bulletin, 1994