Feasibility study of electroless copper deposition for VLSI
- 1 November 1991
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 53, 345-352
- https://doi.org/10.1016/0169-4332(91)90284-q
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Selective electroless copper for VLSI interconnectionIEEE Electron Device Letters, 1989
- Selectively deposited nickel film for via fillingIEEE Electron Device Letters, 1989
- Selective Electroless Metal Deposition for Integrated Circuit FabricationJournal of the Electrochemical Society, 1989
- Selective Electroless Metal Deposition for Via Hole Filling in VLSI Multilevel Interconnection StructuresJournal of the Electrochemical Society, 1989
- The Characterization of Via‐Filling Technology with Electroless Plating MethodJournal of the Electrochemical Society, 1986