Quality inspection in PCBs and SMDs using computer vision techniques

17 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

Vol. 2, 857-861
https://doi.org/10.1109/iecon.1994.397899

Abstract

This paper addresses the task of automating the visual inspection of printed circuit board with through hole technique, and surface mount devices (SMD). We have focused on the following quality control of the mounted component using either technology: component twist, or pin defects. A comparison of binarization techniques as well as twist angle estimation methods have been carried out. For inspection of pin defects various morphological image processing techniques have been applied.

Keywords

INSPECTION
COMPUTER VISION
PRINTED CIRCUITS
CIRCUIT TESTING
SURFACE MORPHOLOGY
MANUFACTURING
CHARACTER RECOGNITION
PARTITIONING ALGORITHMS
AUTOMATIC CONTROL
IMAGE PROCESSING

This publication has 1 reference indexed in Scilit:

A survey of thresholding techniques
Computer Vision, Graphics, and Image Processing, 1988