Flip-chip replacement within the constraints imposed by multilayer ceramic (MLC) modules
- 1 January 1984
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 13 (1) , 29-46
- https://doi.org/10.1007/bf02659834
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969