Abstract
Diamond made by a dc arc-jet chemical vapor deposition (CVD) process is being successfully applied as a packaging material for semiconductor lasers. This CVD process is capable of making free-standing wafers up to 15 cm in diameter with thermal conductivity values similar to natural, type IIa diamond. A novel mathematical analysis using the surface element method was performed to predict the most cost effective size for a CVD diamond submount as a function of the laser size. A literature review of thermal modelling studies and performance testing indicates the outstanding performance benefits which can be realized with CVD diamond laser diode submounts.

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