Oxidative Removal of Photoresist by Oxygen/Freon® 116 Discharge Products

Abstract
Microwave discharge products of a few percent of in have been used for the study of the removal of Shipley AZ 1350J photoresist as a function of time and temperature. The removal rate was found to increase with increasing concentration. The activation energy of removal has been determined for concentrations ranging from 0.048 to 0.81 volume percent. Initially, the activation energy decreases rapidly to 0.34 eV for concentrations ranging from 0.048% to 0.10% and continues to decrease with increasing concentrations to approximately 0.16 eV at 0.81% . The results reported apply to the removal of Shipley AZ 1350J photoresist, but are likely to indicate the oxidative‐removal trends of other organic residues.

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