Low Expansivity Organic Substrate for Flip-Chip Bonding
- 1 March 1979
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 2 (1) , 140-144
- https://doi.org/10.1109/tchmt.1979.1135408
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969