Ultra-Low Thermal Conductivity in W/Al 2 O 3 Nanolaminates
Top Cited Papers
- 13 February 2004
- journal article
- other
- Published by American Association for the Advancement of Science (AAAS) in Science
- Vol. 303 (5660) , 989-990
- https://doi.org/10.1126/science.1093711
Abstract
Atomic layer deposition and magnetron sputter deposition were used to synthesize thin-film multilayers of W/Al2O3. With individual layers only a few nanometers thick, the high interface density produced a strong impediment to heat transfer, giving rise to a thermal conductivity of ∼0.6 watts per meter per kelvin. This result suggests that high densities of interfaces between dissimilar materials may provide a route for the production of thermal barriers with ultra-low thermal conductivity.Keywords
This publication has 15 references indexed in Scilit:
- Nanoscale thermal transportJournal of Applied Physics, 2003
- Thermal Barrier Coatings for Gas-Turbine Engine ApplicationsScience, 2002
- Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and StructuresJournal of Heat Transfer, 2001
- Atomic layer deposition of tungsten using sequential surface chemistry with a sacrificial stripping reactionThin Solid Films, 2000
- Algorithm for solutions of the thermal diffusion equation in a stratified medium with a modulated heating sourceHigh Temperatures-High Pressures, 1999
- Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic MicrostructuresJournal of Heat Transfer, 1996
- Thermal conductivity of sputtered oxide filmsPhysical Review B, 1995
- Surface chemistry of Al2O3 deposition using Al(CH3)3 and H2O in a binary reaction sequenceSurface Science, 1995
- Kapitza conductance and heat flow between solids at temperatures from 50 to 300 KPhysical Review B, 1993
- Thermal boundary resistanceReviews of Modern Physics, 1989