Inelastic deformation of polyimide-copper thin films
- 15 August 1991
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 142 (1) , 135-144
- https://doi.org/10.1016/0921-5093(91)90762-c
Abstract
No abstract availableKeywords
This publication has 17 references indexed in Scilit:
- Stress relaxation during thermal cycling in metal/polyimide layered filmsJournal of Applied Physics, 1988
- Adhesion and deformation study of metal/polymer structures by a stretch deformation methodApplied Physics Letters, 1988
- Adhesion and interface investigation of polyimide on metalsJournal of Adhesion Science and Technology, 1988
- Curing studies of a polyimide precursor. II. Polyamic acidJournal of Polymer Science Part A: Polymer Chemistry, 1987
- An evaluation of confocal versus conventional imaging of biological structures by fluorescence light microscopy.The Journal of cell biology, 1987
- Curing studies of a polyimide precursorJournal of Polymer Science Part A: Polymer Chemistry, 1987
- Adhesion and interface studies between copper and polyimideJournal of Adhesion Science and Technology, 1987
- The internal stress in thin silver, copper and gold filmsThin Solid Films, 1985
- Measurement of stresses generated in cured polyimide filmsJournal of Vacuum Science & Technology A, 1983
- Stress Relaxation and the Plastic Deformation of SolidsPhysica Status Solidi (b), 1964