A model of deadherence due to stresses in an elastic film

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Abstract
A general solution for the tensile stress normal to the film-substrate interface in an elastic film in contact with a rigid substrate is derived by a Fourier transform method in terms of a given traction distribution in the plane of the interface. This is shown to reduce to a simple form for sufficiently thin films. A `critical stress' model of adhesion is then used to give an estimate of the film thickness for three possible forms of traction distribution varying in only one dimension. The solution is extended to traction distributions varying in two dimensions and a criterion for its validity derived in this case.