Popcorn phenomena in a ball grid array package

• 1 August 1995
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
• Vol. 18  (3) , 491-495
• https://doi.org/10.1109/96.404107

Abstract

Keywords

• MOISTURE
• DEFORMATION
• DELAMINATIONS
• DELAMINATION
• TOMOGRAPHY
• FEM
• FINITE ELEMENT ANALYSIS
• THERMAL EXPANSION
• ASSEMBLY
• FINITE ELEMENT METHOD
• BALL GRID ARRAY
• WATER VAPOR
• INTEGRATED CIRCUIT PACKAGING
• OPTICAL MICROSCOPY
• ELECTRONICS PACKAGING