Pulsed CO2 laser etching of polyimide
- 5 May 1986
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 48 (18) , 1226-1228
- https://doi.org/10.1063/1.96989
Abstract
Etching of thin polyimide films in air was investigated using a line tunable, pulsed CO2 laser. The threshold fluence for etching at a wavelength of 944 cm−1 (10.6 μm) exceeds that at 1087 cm−1 (9.2 μm) by a factor of 4. This is consistent with the infrared absorption spectrum which shows polyimide to be significantly more absorbing at 1087 cm−1. As a result, etching at 1087 cm−1 produces a cleaner, more precisely defined region. Analysis of the vapors generated during laser etching shows the simple gases CO2, H2O, and CO to be present.Keywords
This publication has 7 references indexed in Scilit:
- Excimer laser etching of polyimideJournal of Applied Physics, 1985
- Calorimetric and acoustic study of ultraviolet laser ablation of polymersApplied Physics Letters, 1985
- Excimer laser ablation and thermal coupling efficiency to polymer filmsJournal of Applied Physics, 1985
- Emission spectra and etching of polymers and graphite irradiated by excimer lasersJournal of Applied Physics, 1984
- CO2 laser assisted UV ablative photoetching of Kapton filmsApplied Physics Letters, 1984
- Direct etching of polymeric materials using a XeCl laserApplied Physics Letters, 1983
- Kinetics of the ablative photodecomposition of organic polymers in the far ultraviolet (193 nm)Journal of Vacuum Science & Technology B, 1983