Auger examination of contaminants in thin−film metallizations
- 1 February 1975
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 46 (2) , 963-965
- https://doi.org/10.1063/1.321628
Abstract
Gold nichrome metallizations vacuum evaporated at (10−6 Torr) have been examined with Auger electron spectroscopy and argon ion sputtering techniques. The primary contaminants within the films were carbon and oxygen, which were concentrated in the underlying nichrome film. The contaminants were believed to be due to residual gases present during evaporation. The significance of these results for eutectic bonding processes is discussed.This publication has 3 references indexed in Scilit:
- Diffusion measurements in thin films utilizing work function changes: Cr into AuJournal of Applied Physics, 1972
- Chemical Effects in Auger Electron SpectroscopyJournal of Applied Physics, 1972
- Interdiffusion in thin conductor films — chromium/gold, nickel/gold and chromium silicide/goldMetallurgical Transactions, 1971