Connection of VLSI chips to printed circuit board using stacked solder bumps
- 5 November 1987
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 23 (23) , 1238-1240
- https://doi.org/10.1049/el:19870862
Abstract
A new type of flip-chip interconnection technology usingstacked solder bumps is proposed, where the diameter of theupper solder bump is less than that of the lower ones. This isto reduce the capacitance between the stacked solder bumps and the ground plane and to prolong the lifetime ofthe solder joints.Keywords
This publication has 0 references indexed in Scilit: