Plasma formation of buffer layers for multilayer resist structures

1 September 1981

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters

Vol. 2 (9) , 222-224
https://doi.org/10.1109/EDL.1981.25411

Abstract

Recently, Li and Richards described a plasma treatment which may be used to prevent intermixing of successive layers of positive resists. We have studied the characteristics of the fluorinated polymer layers produced by this process, and have used a modification of the process to perform multilayer lithography for device fabrication.

Keywords

BUFFER LAYERS
NONHOMOGENEOUS MEDIA
RESISTS
PLASMA APPLICATIONS
SURFACE TREATMENT
PLASMA MEASUREMENTS
PLASMA DISPLAYS
ETCHING
PLASMA PROPERTIES
FABRICATION

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