Study of the Al‐Al₂O₃ Bond Interface

• 1 July 1987
• journal article
• Published by Wiley in Journal of the American Ceramic Society
• Vol. 70  (7) , C‐154-C‐156
• https://doi.org/10.1111/j.1151-2916.1987.tb05693.x

Abstract

Keywords

• SILICON
• INTEGRATED CIRCUIT
• ALUMINA
• EVAPORATION
• ALUMINUM
• AL2O3 BOND
• BOND INTERFACE