Plasma processes and adhesive bonding of polytetrafluoroethylene
- 15 May 1993
- journal article
- research article
- Published by Wiley in Surface and Interface Analysis
- Vol. 20 (5) , 331-336
- https://doi.org/10.1002/sia.740200502
Abstract
The virtues of chemical inertness and low surface energy which make polytetrafluoroethylene (PTFE) a valuable engineering polymer also account for the difficulty in achieving structural adhesive bonds. While plasma surface treatment has proven to be the most effective means of maximizing strength and permanence of adhesive bonds with the most inert of engineering polymers, a simple plasma treatment has proven elusive for PTFE. The following studies evaluate two very different plasma processes, activation and deposition, as a means to achieve reliable and high‐strength structural adhesive bonds. Sodium naphthalene‐etched PTFE is used as a control. Presented are ESCA data which support a theory that improvement is limited by a weakened boundary layer of the PTFE.Keywords
This publication has 5 references indexed in Scilit:
- Chemical and physical modification of fluoropolymer surfaces for adhesion enhancement: a reviewJournal of Adhesion Science and Technology, 1989
- Fluoropolymer surface studiesJournal of Colloid and Interface Science, 1974
- An analysis of PTFE surfaces modified by exposure to glow dischargesEuropean Polymer Journal, 1973
- Surface treatment of polymers for adhesive bondingJournal of Applied Polymer Science, 1967
- Activation of Plastic Surfaces in a PlasmajetI&EC Product Research and Development, 1964