Measurements of residual stresses in thin films deposited on silicon wafers by indentation fracture
- 19 October 1999
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 47 (14) , 3869-3878
- https://doi.org/10.1016/s1359-6454(99)00248-7
Abstract
No abstract availableKeywords
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