Ion-implanted n-channel InP metal semiconductor field-effect transistor

Abstract
Device‐quality n‐type layers have been produced by ion implantation in Fe‐doped semi‐insulating InP. 29Si has been used as the dopant and anneals were carried out with the aid of a multiple‐layered encapsulant consisting of plasma‐deposited Si3N4 and pyrolytic P‐doped SiO2. These layers have been used to make n‐channel MESFET’s for which gains of 13.7 and 9.8 dB were measured at 8 and 10 GHz, respectively. The gate metallization for these devices was Au. Low‐leakage currents and adequate gate breakdown characteristics were observed.

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