Thermo-Mechanical Cycling Behavior of Al Thin-Film Metallization

• 1 April 1986
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
• No. 07350791,p. 253-259
• https://doi.org/10.1109/irps.1986.362142

Abstract

Keywords

• THERMOMECHANICAL PROCESSES
• TRANSISTORS
• METALLIZATION
• SUBSTRATES
• CREEP
• ELECTRICAL RESISTANCE MEASUREMENT
• STRESS MEASUREMENT
• TEMPERATURE
• SPUTTERING
• THERMAL STRESSES