Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits.
- 1 January 1993
- journal article
- Published by Iron and Steel Institute of Japan in ISIJ International
- Vol. 33 (2) , 336-342
- https://doi.org/10.2355/isijinternational.33.336
Abstract
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