Optical single layer lift-off process

1 March 1985

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices

Vol. 32 (3) , 672-676
https://doi.org/10.1109/t-ed.1985.21997

Abstract

The lithography of the metal wiring layers is becoming the most confining technology in the era of VLSI (very large-scale integration), as more and more circuits have to be wired on the chip itself. The two competing technologies are subtractive etch (wet or dry), and additive metal lift-off. As lift-off needs no etching, it inherently offers cost and density advantages. It, however, requires an undercut photoresist profile. These undercuts can be achieved with an image-reversal process. The paper describes such a reversal process, especially tuned for lift-off applications. The result is a simple single-layer lift-off technology with excellent image quality.

Keywords

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