Solution Chemistry and Colloid Formation in the Tin Chloride Sensitizing Process
Open Access
- 1 January 1972
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 119 (4) , 433-438
- https://doi.org/10.1149/1.2404224
Abstract
For many years, stannous chloride solutions have been used to prepare surfaces so that they would catalyze deposition from electroless plating solutions. This paper discusses the colloid and solution chemistry of such baths, including the colloid formation, size mediation, and aging processes. The colloid is shown to be nucleated by stannic ions, and mediated by stannous ions. The investigation was carried out primarily using Mössbauer spectroscopy to characterize the materials involved.Keywords
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