Electroless Deposition of Copper on Surface Modified Poly(tetrafluoroethylene) Films from Graft Copolymerization and Silanization
- 21 April 2000
- journal article
- Published by American Chemical Society (ACS) in Langmuir
- Vol. 16 (11) , 5192-5198
- https://doi.org/10.1021/la9914211
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Functionalization and metallization of fluoropolymer surfaces through reduction1,2Journal of Applied Polymer Science, 1995
- Fluoropolymer metallization for microelectronic applicationsProgress in Surface Science, 1994
- Surface modification of polytetrafluoroethylene by microwave plasma downstream treatmentPolymer, 1994
- Metallization of Teflon PFA. I. Interactions of evaporated Cr and Al measured by x-ray photoelectron spectroscopyJournal of Vacuum Science & Technology A, 1994
- Adhesive Electroless Metallization of Fluoropolymeric SubstratesScience, 1993
- Plasma surface modification of polymers for improved adhesion: a critical reviewJournal of Adhesion Science and Technology, 1993
- Monolayer chemical lithography and characterization of fluoropolymer filmsLangmuir, 1992
- Adhesion studies of metals on fluorocarbon polymer filmsJournal of Vacuum Science & Technology A, 1990
- Surface modification of poly(tetrafluoroethylene) with benzoin dianionMacromolecules, 1984
- Adhesion of evaporated metallic films onto polyethylene and poly(tetrafluoroethylene): Importance of surface crosslinkingJournal of Applied Polymer Science, 1979