Self-aligned CoSi2 and TiW(N) local interconnect in a submicron CMOS process
- 1 September 1989
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 38 (1) , 458-466
- https://doi.org/10.1016/0169-4332(89)90567-9
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Direct silicidation of Co on Si by rapid thermal annealingIEEE Transactions on Electron Devices, 1987
- Development of the self-aligned titanium silicide process for VLSI applicationsIEEE Transactions on Electron Devices, 1985
- Interactions in the Co/Si thin-film system. I. KineticsJournal of Applied Physics, 1978