Electrodeposited copper oxide films: Effect of bath pH on grain orientation and orientation-dependent interfacial behavior
- 18 October 2006
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 515 (5) , 3090-3095
- https://doi.org/10.1016/j.tsf.2006.08.041
Abstract
No abstract availableKeywords
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