Low Temperature Soldering

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Abstract
Soldering of electronic components on printed boards generally takes place at temperatures of between 240 and 250°C. During soldering, the components and printed boards are exposed to thermal shock that affects their long‐term reliability. A reduction in the soldering temperature to about 180°C using low melting point solders is expected to decrease component failures. The authors describe tests on a number of possible solders and the development of a suitable low temperature flux.

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