Abstract
The noble metals generally demonstrate minimal adhesion to oxide and halide surfaces. The film adherence has been shown to be often significantly improved by specific substrate treatments prior to deposition. In this work, we report on the effect on gold adhesion due to two surface treatment processes: argon or oxygen ion bombardment of the substrate surface and the deposition of an intermediate oxide or halide layer, immediately prior to the gold deposition. The results will be shown to be consistent with an adhesion model based on charge transfer at the metal–nonmetal interface and the resultant electrostatic stress and field enhanced diffusion.

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