Potentiodynamic Investigation of Cu in Alkaline Phosphate Solutions Containing Added Anions

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Abstract
The effect of , Cl−, and I− on the intensity of anodic peak currents for the successive processes that occur on Cu in alkaline phosphate media has been studied. At the same sweep rate repeated excursions resulted in a significant anodic current increase for the process corresponding to Cu(I) oxide formation; the anodic peak current of Cu(II) remained unaffected. Also Cu(I) and Cu(II) processes exhibited significant differences in their response to cycling at increasing scan rate. The increase of the anodic current for Cu(I) formation with increasing [Cl−] showed a definite tendency to level off. Cu(II) anodic currents exhibited a continuous increase with increasing [Cl−]. At relatively high [Cl−] current oscillations were observed which have been explained. A mechanism of Cl− attack involving adsorption, interaction with a soluble intermediate, and peptization of the passivating products is discussed. The effect of the Cl− ion revealed that passivating Cu(II) products were formed, most probably, via a diffusion‐controlled pathway.

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