Pt/(Ba, Sr)TiO3/Pt capacitors are fabricated using DC and RF magnetron sputtering processes on thermally oxidized silicon wafers for ultralarge scale integrated dynamic random access memory (ULSI DRAM) applications. (Ba,Sr)TiO3 (BST) thin film deposited at 640°C to 20 nm thickness shows an equivalent SiO2 thickness (t oxeq) of 0.35 nm and a leakage current density, measured at an applied voltage of 1.5 V, of about 100 nA/cm2. t oxeq of the BST film and leakage current density are further decreased to 0.24 nm and 40 nA/cm2, respectively, by postannealing at 750°C after fabrication of the top electrode.