The Properties of Composite Solders
- 1 January 1993
- book chapter
- Published by Springer Nature
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- The effect of particle shape on dispersion hardeningPublished by Elsevier ,2003
- Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscopeJournal of Materials Science, 1992
- Processing dispersion-strengthened SnPb solders to achieve microstructural refinement and stabilityScripta Metallurgica et Materialia, 1991
- Investigation of Creep/Fatigue Interaction on Crack Growth in a Titanium Aluminide AlloyJournal of Engineering Materials and Technology, 1990
- Thermomechanical fatigue of solder joints: a new comprehensive test methodIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- The microstructural details of β-Sn precipitation in a 5Sn-95Pb solder alloyMetallurgical Transactions A, 1989
- A microstructural study of the thermal fatigue failures of 60sn-40Pb solder jointsJournal of Electronic Materials, 1988
- Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloyMaterials Science and Engineering, 1981
- Deformation mechanism maps for superplastic materialsScripta Metallurgica, 1976
- Creep behaviour in the superplastic Pb–62% Sn eutecticPhilosophical Magazine, 1975