High Pinout IC Packaging and the Density Advantage of Surface Mounting
- 1 September 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (3) , 298-304
- https://doi.org/10.1109/tchmt.1983.1136191
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Circuit Pack Parameter Estimation Using Rent's RuleIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1982