Measurements of crosstalk between closely-packed lossy microstrips on silicon substrates

24 May 1990

journal article
Published by Institution of Engineering and Technology (IET) in Electronics Letters

Vol. 26 (11) , 714-716
https://doi.org/10.1049/el:19900466

Abstract

The measured near-end and far-end crosstalks for closely-packed microstrips are reported. The near-end crosstalk is less than 10% and the far-end crosstalk is less than 5% (of the driven signal) between two microstrips with 10μm width and 10μm spacing, when the active line is driven by a fast step pulse with ̃40ps rise time. Based on our measurements, we believe that closely-packed lossy microstrips can be used for high speed digital signal transmission, without much concern of crosstalk.

Keywords

VLSI CHIPS INTERCONNECTION
WIDTH
CROSSTALK MEASUREMENTS
40 PS
NEAR-END CROSSTALK
CLOSELY-PACKED MICROSTRIPS
SI SUBSTRATES
FAR-END CROSSTALK
CLOSELY-PACKED LOSSY MICROSTRIPS
HIGH SPEED DIGITAL SIGNAL TRANSMISSION
RISE TIME
10 MICRON
FAST STEP PULSE
SPACING

This publication has 1 reference indexed in Scilit:

Multi-chip packaging technology for VLSI-based systems
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1987