Low-temperature silicon-to-silicon anodic bonding with intermediate low melting point glan
- 1 April 1990
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 23 (1-3) , 931-934
- https://doi.org/10.1016/0924-4247(90)87062-n
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Silicon-to-silicon direct bonding methodJournal of Applied Physics, 1986
- Anodic bonding of imperfect surfacesJournal of Applied Physics, 1983
- Low-Temperature Electrostatic Silicon-to-Silicon Seals Using Sputtered Borosilicate GlassJournal of the Electrochemical Society, 1972