3-D microsystem packaging for interconnecting electrical, optical and mechanical microdevices to the external world
- 7 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
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- Delay-Msking Process for Silicon Three-Dimensional Bulk StructuresIEEJ Transactions on Sensors and Micromachines, 1999